EFFICIENT, ECONOMICAL, AND VERSATILE

Metal deposition with brush electroplating is extremely efficient. Brooktron plating solutions have a very high metal concentration with a fast rate of deposition. The deposit is a pure metal with a fine grain structure. It is hard and free from porosity with virtually no hydrogen embrittlement as is often found in conventional plating processes. The metal adhesion is excellent, with low stress and metal fatigue.

DISASSEMBLY NOT REQUIRED

Save time and money. Because brush electroplating deposits metal on localized areas, components do not require disassembly and reassembly. There is no need for costly masking, special fixtures, or handling. In addition, costly solution inventory normally needed for tank plating operations is eliminated.

The versatility of the Brooktron Process is due to the portability of the system and the wide variety of metals which can be deposited. Brooktron equipment is built to move. The entire process can be performed in any environment— research laboratory, shipyard, machine shop, maintenance department, production line, clean room, etc.

A single technician can be trained to perform a vast number of plating operations.

HISTORY

Brooktronics Engineering Corporation, established in 1960, has been a pioneer in the relatively new field of selective electrochemical deposition of metals generally referred to as brush electroplating. Founded by a chemical engineer with extensive experience in aerospace and electronics related industries, Brooktronics, from its inception, applied engineering techniques to solve a wide variety of plating problems.

This in-depth approach has provided Brooktronics with the opportunity to develop prototypes for plating processes that have greatly expanded the diversity of brush plating applications.